HYPERCOOL:
THE WATERLESS LIQUID COOLING SOLUTION FOR AI + HPC

The ZutaCore® HyperCool® system uses direct-to-chip, waterless liquid cooling to provide simple and risk-free heat removal and reuse for more sustainable AI + HPC applications. 

Image 15  How It Works

HyperCool is a two-phase, closed-loop liquid cooling solution for the hottest processors of 2800W and beyond.  It uses a direct-to-chip method — one of the most effective forms of chip cooling — to apply waterless heat transfer fluid directly to the chips to extract and disperse heat. Since no water is used in the cooling solution, equipment is fully protected from leaks, corrosion, and other water-related threats.

The HyperCool direct-to-chip liquid cooling solution is easily scalable and can be deployed in new or retrofitted data centers, supporting 120kW and above of computing power. The innovative design of HyperCool allows for sustainable, 100% heat re-use in the data center, producing the lowest 1.05 -1.07 PUE and highest efficiency in any climate.

Key Features of HyperCool

HyperCool features a groundbreaking closed-loop liquid cooling system that operates at low pressure and moves large amounts of heat off the processors and away from the servers. 

Waterless Direct-to-Chip Liquid Cooling Solution

Heat transfer fluid is 100% IT safe and will not damage the server even in the unlikely event of a leak.

Low Maintenance Direct-to-Chip Solution that Increases Compute Density

ZutaCore HyperCool increases compute density by >250kW per rack of computing power. The heat transfer fluid never needs to be replaced and does not get released into the atmosphere during server and rack maintenance.

Simple, Compact, Future Ready Data Center Solution

HyperCool supports up to and beyond 2800 watts per processor in a 1U server form factor.

Reduces Energy Consumption

Direct-to-chip liquid cooling technology saves up to 80% power consumption compared to air-based cooling

100% Heat Reuse

The liquid maintains a constant temperature, therefore the heat from the servers can be harvested for heat re-use such as heating adjacent offices or inside the data center.

50% Less Space

Direct-to-chip waterless liquid cooling uses half the space of air-based and 75% less space than immersion cooling. Requires little to no data center infrastructure change and can be retrofitted on existing servers.

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ZutaCore HyperCool

A COMPLETE DATA CENTER COOLING SOLUTION

Direct-to-chip waterless liquid cooling delivers 10x more compute, 50% TCO reduction, and reduced CO2 emissions for a sustainable data center and industry. The ZutaCore HyperCool system includes:

WATERLESS
COLD PLATES

Experience advanced cooling with the ZutaCore HyperCool state-of-the-art waterless cold plate technology. The HyperCool cold plate efficiently manages heat dissipation for high-performance AMD, Intel, and NVIDIA processors by employing a pool-based boiling process with heat transfer fluid.

The waterless cold plate vaporizes the heat transfer fluid supplied from the manifold to cool CPUs or GPUs, and the resulting vapor flows naturally to the Heat Rejection Unit (HRU) for condensation back to liquid form. This low-pressure, on-demand cooling system can handle over 2800 watts and ensures optimal heat management. Eliminating water effectively prevents corrosion, thereby protecting your equipment.

This eco-friendly, simple, scalable solution reduces power usage by 82%, increases compute density, and brings sustainability to the data center. Compatible with leading server manufacturers like Dell, Super Micro, Asus, and others, HyperCool is ideal for businesses seeking sustainable cooling solutions that deliver exceptional performance without throttling.

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Heat Rejection Units

HyperCool is scalable and can be deployed in new or retrofitted data centers. It supports 120kW and beyond of computing power when used with a 6U water or 6U air in-rack Heat Rejection Unit (HRU). These self-contained, fully autonomous units have independent sensors, pumps, controllers, and multi-level leak detection and prevention. The HRU moves the liquid to the servers and ensures efficient condensation of the vapor and rejection of the heat it contains.  The innovative design of HyperCool allows heat re-use in the data center producing PUE as low as 1.05 - 1.07 and highest efficiency in any climate. 

For targeted installations that don’t require the full power of the 6U, our 3U Heat Rejection Unit supports up to 60kW of computing power with the same non-conductive fluid. Enjoy no data center downtime and a fully automatic operating system with the peace of mind of redundant pumps, power supplies, and power sources.

HRUs

Manifold

Introducing the HyperCool Manifold: the ultimate solution for efficient data center cooling. This self-contained manifold is designed to integrate seamlessly with both standard and custom racks, accommodating up to 42 servers for left and right installations.

Key Features:

  • Uniform Thermal Management: The HyperCool Manifold distributes waterless heat transfer fluid uniformly to all servers, preventing overheating and ensuring optimal performance.
  • Efficient Heat Dissipation: Channels hot vapors to the Heat Rejection Unit, optimizing heat dissipation, enhancing equipment longevity, and boosting energy efficiency.
  • Flexible Installation: Mountable on either side of the rack, it installs easily on accessory channel keyholes with adjustable buttons, offering a customizable length to fit any rack size.
  • Hot-Swappable Functionality: Enjoy uninterrupted server operation with the manifold's hot-swappable design.
  • Quick and Secure Setup: Benefit from rapid installation with secure, detachable connections.
  • Powerful Performance: Each manifold, featuring separate vapor and liquid chambers, manages 35kW with 700W per server, transporting hot vapor to the Heat Rejection Unit for efficient condensation and recirculation.

Enhance your data center's cooling efficiency with the HyperCool Manifold and enjoy improved performance and reliability.

Manifold

SOFTWARE DEFINED COOLING

The HyperCool Software Defined Cooling (SDC) solution automates resource provisioning and management to improve system performance and optimization. It provides monitoring and control for the server CPUs and the Heat Rejection Units. It also provides server performance data and analytics — temperatures, load, utilization, clock speed, fan speed, and power consumption.

HYPERCOOL SOFTWARE DEFINED COOLING

The Benefits of Waterless Liquid Cooling

With ZutaCore’s waterless, direct-to-chip liquid cooling solution organizations can easily increase their compute density, deliver power savings, and zero emissions in the data center.

INCREASES PERFORMANCE & RELIABILITY

  • Waterless direct-to-chip liquid cooling
  • Increases compute density >250kW per rack
  • Future-ready – up to 2800W and beyond

ZERO EMISSIONS
DATA CENTERS

  • 82% lower energy consumption compared to air
  • 100% heat reuse without heat pumps
  • Increased compute density reducing water & land usage

OPEX & CAPEX SAVINGS

  • ROI in <2-years (instant for new AI factories)
  • No chillers/CRAC required
  • ~$1M saved on 2MW data center annually

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We’re Ushering
in a New, Net Zero Generation of
Data Centers

Take a closer look at the waterless, direct-to-chip liquid cooling technology bridging the gap between data industry sustainability and ever-increasing computing power.

Solving the Top 5 Cooling Challenges of AI+HPC

Our eBook discusses why performance- and sustainability-minded operators alike are turning to liquid cooling for a zero-emission data industry.
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