As NVIDIA HGX B300-class AI platforms drive unprecedented server power densities that strain traditional cooling methods, this joint ASRock Rack and ZutaCore webinar explores how an integrated server design and waterless two-phase direct-to-chip cooling architecture enables scalable, high-density AI deployments with improved performance, reliability, faster deployment, and lower total cost of ownership compared to air, single-phase liquid, immersion, and hybrid alternatives.

Join Holger Engenent from the University of Münster and ZutaCore to hear why they chose waterless direct-to-chip liquid cooling.