Waterless Liquid Cooling For AI Factories
Unlock the full potential of your AI infrastructure with HyperCool® from ZutaCore® — the waterless, direct-to-chip cooling solution engineered for high-density and high-performance environments.
AI is Heating Up the Data Industry.
Are You Ready?
The IEA forecasts data centers will use more than 1,000 terawatt-hours of electricity by 2026.1 — double the terawatt-hours used in 2022. High-performance computing and AI have brought incredible thermal loads, and AI factories are still scaling up.
AI factory operators must find a way to thread the needle of power efficiency, net-zero targets, and ever-growing compute density, all without compromising performance or reliability. Conventional cooling can’t take the heat.
AI factories could draw up to 21 percent of the world’s electricity supply by 2030.
Liquid cooling solutions are expected to jump from 11% adoption in 2024 to 24% in 2025.
Microsoft data centers use >1.7 billion gallons of water per year — enough to fill over 2,500 Olympic swimming pools.
Cooling Challenges in AI Factories

Heat Management
Unprecedented heat loads can surpass 2,800W per chip. Conventional cooling methods (air, water) cannot prevent hardware throttling or failures.

High Energy Costs
Cooling consumes up to 40% of the energy in AI factories. Operational budgets and infrastructure are heavily strained.

Compute Density
Next-gen AI deployments pack more GPUs and CPUs into each rack. Airflow constraints and temperature thresholds demand a solution.
The HyperCool® Solution

Direct-To-Chip Cooling
Our cold plates dissipate heat at its source with two-phase pool boiling and condensation of a waterless heat transfer fluid. No more water leaks in your AI factory.

Increased Compute Density
By maintaining optimal chip temperatures, HyperCool enables up to 10x more compute in the same footprint — with no performance throttling.

Energy Savings
Hypercool reduces cooling energy consumption by up to 50%, significantly cutting operational costs and bolstering long-term profitability.

Sustainable Cooling
With zero water usage, up to 100% heat reuse, and reduced carbon emissions, HyperCool supports net-zero initiatives without sacrificing performance.
Why Choose HyperCool® For AI Factories?
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Scalability
Modular design grows with you, supports 120kW and above per rack, and integrates easily into new or existing AI infrastructure.

Reliability
Our closed-loop architecture mitigates leak risks and corrosion. Even under 2,800W+ chip loads, AI operations experience minimal downtime.
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Performance
Eliminate thermal bottlenecks to achieve stable clock speeds and optimize throughput for every workload.
What Our Clients Are Saying
Earl Dodd
Global HPC Business Practice Leader at WWT
Holger Angenent
Leader of CIT e-Science Infrastructure Group at University of Münster
Maurizio Davini
CTO at University of Pisa
Transform Your AI Factory With HyperCool®
Dive Into Cutting-Edge Cooling Solutions For AI Factories
We’re excited to share insights that can help your AI facility scale effectively, reduce costs, and achieve unprecedented cooling efficiency. Access this eBook to learn more.
