4 June 2020 | 1 p.m. CT | Watch Here
Blowing Off Some Steam – The Future of High Density Cooling Solutions
Data center owners and operators are faced with the rapidly growing demand for leveraging higher powered processors within existing infrastructures. To fully realize the potential of IOT, 5G, AI, autonomous vehicle, edge and other business critical applications, they need to think about what is next? Whether you are a hyperscale, colocation, telecommunication or enterprise data center, the reality is that conventional air and single-phase on-chip water technologies are at a tipping point and creating cooling boundaries at the chip, server, rack, POD and data center levels.
Register today to learn how Rittal is expanding its high-performance cooling solutions through its partnership with ZutaCore to address the myriad of crucial challenges from data center densification to hot chips to hot spots to edge and transforming their data center economics. Together, we are deploying the world’s first integrated data center solutions that utilizes proven, direct on-chip, waterless, evaporative liquid cooling enabling dense computing environments and processors of 900W and beyond, reduced capital and operating costs while improving performance, energy consumption and utilization of space for existing and new builds, including locations with limited-air, infrastructure and serviceability e.g. Edge or 5G.
- Rittal – Kevin Nusky, Senior Director – Data Center Solutions
- ZutaCore – Chuck Dooley, EVP Global Sales