Technological innovation is one of the foundations of the improved quality of life of people around the globe. Recent innovations including machine learning, artificial intelligence and 5G computing are built on the foundation of high-powered computing. Unfortunately, the conventional means for handling the heat generated by increasingly higher-powered processors is just not able to keep up with the rapid densification at all levels. A new approach, Direct Contact Evaporative Cooling (DCEC), can now be integrated into racks and data centers seamlessly and can support today’s requirements while saving space and energy. In addition, it is practically unlimited in its ability to handle any high-powered processor that technological innovation may require in the future. Please read on to learn how DCEC can remove the constraints imposed on innovation by other cooling technologies.