CANCELLED | 36th Annual SEMI-THERM | Liquid Cooling Panel Presentation

19 March, 2020 | 2-4 p.m. San Jose, CA | DoubleTree

For the last 10 years, Liquid Cooling has been a “technology that will be widely adopted in the next 2 to 3 yers.” Are we actually at that place now? What are the barriers to adoption that may keep liquids out of electronics chassis for even longer? What are the “dream features” of a cooling technology that would truly remove thermal constraints in your application area (without breaking any laws of physics)? What are the applications where there is no choice but to use liquid for electronics cooling? This panel will provide a unique perspective on these and other questions, with representatives from the following end users and implementers:

Moderator: ZutaCore, Tim Shedd

Panel Members:

  • E52 NSF Industry-University consortium – Villanova University, Alfonso Ortega
  • Collins Aerospace, Debabrata Pal
  • Oak Ridge National Laboratory (ORNL), David Grant
  • Service Logic, Greg Crumpton
  • Microsoft, Brandon Rubenstein
  • Intel, Cathy Biber